Semiconductor Wafer Cleaning Technology
2026/10/12~2027/12/31
Batas Akhir Pendaftaran:2027/12/31
8Jam/6setiap minggu (Kelas Sudah Dimulai)

Penjelasan

● Enrollment Now Open
 

Semiconductor fabrication processes and device manufacturing are fundamental to the advancement and production of modern semiconductor technologies.

This course begins with the basic principles of semiconductor wafer cleaning, including both wet and dry cleaning processes as well as contamination control technologies. It then introduces semiconductor isolation techniques, covering their fundamental concepts, historical development, and technological evolution.

Through this course, learners will gain a foundational understanding of critical semiconductor fabrication processes and the technologies that enable the reliable manufacturing of advanced semiconductor devices.

Tujuan kursus

Upon completing this course, students will develop a fundamental understanding of semiconductor wafer cleaning technologies and isolation techniques, including the following key concepts:

1
The historical development and evolution of semiconductor cleaning technologies
2
The fundamental principles of wet and dry cleaning processes
3
The principles of photolithography and etching in semiconductor isolation processes

Pengajar

Professor Tien-Sheng Chao
Professor Tien-Sheng Chao (趙天生)
Department of Electrophysics
National Yang Ming Chiao Tung University

Professor Tien-Sheng Chao is currently a faculty member of the Department of Electrophysics at National Yang Ming Chiao Tung University. He received his Ph.D. degree from the Institute of Electronics, National Chiao Tung University, in 1992. With over 30 years of experience in semiconductor education and research, Professor Chao has made significant contributions to the fields of semiconductor device technology and fabrication processes.

Research Expertise
▪Semiconductor Device Physics
▪Nano-scale Front-End Semiconductor Fabrication Processes
▪Nano-device Fabrication
▪Thin-Film Transistors (TFTs)
▪Ultra-thin Dielectric Layer Fabrication
▪Semiconductor Wafer Cleaning Technologies

Jadwal kursus

Unit 1:Cleaning Technology (1)

Unit 2:Cleaning Technology (2)

Unit 3:Isolation Technology (1)

Unit 4:Isolation Technology (2)

Unit 5:Isolation Technology (3)

Isi kursus

Part 1 — Semiconductor Wafer Cleaning Technology
▪Contamination control
▪Basic concept of wafer cleaning technology
▪Wafer wet cleaning
▪Alternatives to RCA clean
▪Dry cleaning technology
Part 2 — Isolation Technology
▪Introduction
▪Shallow Trench Isolation (STI) technology
▪Silicon-on-Insulator (SOI) isolation technology
▪Bulk FinFET STI

Model kursus

The course is organized into several modules, each consisting of short lessons.

Each lesson is presented as a video of approximately 10–30 minutes, allowing learners to study at their own pace.

Kriteria penilaian

A quiz is provided after each major topic to help learners assess their understanding of the course content. 

KKM


Course Passing Grade:80Grade Memo:max grade 100 point

Kemampuan

This course is designed primarily for third-year undergraduate students or above majoring in Electrical Engineering, Electronics Engineering, or related disciplines.

Students are recommended to have a basic understanding of the following subjects before taking this course:

1
General Physics
2
Calculus
3
Basic Electronics

Informasi Sertifikat

 ewant offers digital certificates. To apply, please refer to the certificate application guide.