Semiconductor Wafer Cleaning Technology
Date to be announced
8Hours/6Weeks

Abstract

● Enrollment Now OpenTentative Course Start: December 2026

Semiconductor fabrication processes and device manufacturing are fundamental to the advancement and production of modern semiconductor technologies.

This course begins with the basic principles of semiconductor wafer cleaning, including both wet and dry cleaning processes as well as contamination control technologies. It then introduces semiconductor isolation techniques, covering their fundamental concepts, historical development, and technological evolution.

Through this course, learners will gain a foundational understanding of critical semiconductor fabrication processes and the technologies that enable the reliable manufacturing of advanced semiconductor devices.

Course Objective

Upon completing this course, students will develop a fundamental understanding of semiconductor wafer cleaning technologies and isolation techniques, including the following key concepts:

1
The historical development and evolution of semiconductor cleaning technologies
2
The fundamental principles of wet and dry cleaning processes
3
The principles of photolithography and etching in semiconductor isolation processes

Instructor

Professor Tien-Sheng Chao
Professor Tien-Sheng Chao (趙天生)
Department of Electrophysics
National Yang Ming Chiao Tung University

Professor Tien-Sheng Chao is currently a faculty member of the Department of Electrophysics at National Yang Ming Chiao Tung University. He received his Ph.D. degree from the Institute of Electronics, National Chiao Tung University, in 1992. With over 30 years of experience in semiconductor education and research, Professor Chao has made significant contributions to the fields of semiconductor device technology and fabrication processes.

Research Expertise
Semiconductor Device Physics
Nano-scale Front-End Semiconductor Fabrication Processes
Nano-device Fabrication
Thin-Film Transistors (TFTs)
Ultra-thin Dielectric Layer Fabrication
Semiconductor Wafer Cleaning Technologies

Course Contents

Part 1 — Semiconductor Wafer Cleaning Technology
Contamination control
Basic concept of wafer cleaning technology
Wafer wet cleaning
Alternatives to RCA clean
Dry cleaning technology
Part 2 — Isolation Technology
Introduction
Shallow Trench Isolation (STI) technology
Silicon-on-Insulator (SOI) isolation technology
Bulk FinFET STI

Course Mode

The course is organized into several modules, each consisting of short lessons.

Each lesson is presented as a video of approximately 10–30 minutes, allowing learners to study at their own pace.

Grading Policy

A quiz is provided after each major topic to help learners assess their understanding of the course content. 

Passing Criteria


Course Passing Grade:80Grade Memo:max grade 100 point

Prerequisites

This course is designed primarily for third-year undergraduate students or above majoring in Electrical Engineering, Electronics Engineering, or related disciplines.

Students are recommended to have a basic understanding of the following subjects before taking this course:

1
General Physics
2
Calculus
3
Basic Electronics