Semiconductor Wafer Cleaning Technology
國立陽明交通大學
開課日期待定
8小時/6週
摘要
課程目標
授課教師
課程內容
上課形式
評分標準

摘要

Enrollment Now Open
Tentative Course Start: December 2026

Semiconductor fabrication processes and device manufacturing are fundamental to the advancement and production of modern semiconductor technologies.

This course begins with the basic principles of semiconductor wafer cleaning, including both wet and dry cleaning processes as well as contamination control technologies. It then introduces semiconductor isolation techniques, covering their fundamental concepts, historical development, and technological evolution.

Through this course, learners will gain a foundational understanding of critical semiconductor fabrication processes and the technologies that enable the reliable manufacturing of advanced semiconductor devices.


課程目標

Upon completing this course, students will develop a fundamental understanding of semiconductor wafer cleaning technologies and isolation techniques, including the following key concepts:

  1. The historical development and evolution of semiconductor cleaning technologies
  2. The fundamental principles of wet and dry cleaning processes
  3. The principles of photolithography and etching in semiconductor isolation processes

授課教師

Professor Tien-Sheng Chao

Department of Electrophysics

National Yang Ming Chiao Tung University

Professor Tien-Sheng Chao is currently a faculty member of the Department of Electrophysics at National Yang Ming Chiao Tung University.

He received his Ph.D. degree from the Institute of Electronics, National Chiao Tung University in 1992. With over 30 years of experience in semiconductor education and research, Professor Chao has made significant contributions to the fields of semiconductor device technology and fabrication processes.

Research Expertise:


  • Semiconductor Device Physics

  • Nano-scale Front-End Semiconductor Fabrication Processes

  • Nano-device Fabrication

  • Thin-Film Transistors (TFTs)

  • Ultra-thin Dielectric Layer Fabrication

  • Semiconductor Wafer Cleaning Technologies

課程內容

Semiconductor Wafer Cleaning Technology

＊Contamination control

＊Basic Concept of Wafer Cleaning Technology

＊Wafer Wet Cleaning

＊Alternatives to RCA Clean

＊Dry Cleaning Technology

Isolation Technology

＊Introduction

＊Shallow Trench Isolation (STI) Technology

＊Silicon-on-Insulator (SOI) Isolation Technology

＊Bulk FinFETs STI

上課形式

The course is organized into five major modules, each consisting of several short lessons.

Each lesson is presented as a video of approximately 10–30 minutes, allowing learners to study at their own pace.


評分標準

  

通過標準


課程及格標準:80分滿分：100分

先修科目或先備能力

This course is designed primarily for third-year undergraduate students or above majoring in Electrical Engineering, Electronics Engineering, or related disciplines.

Students are recommended to have a basic understanding of the following subjects before taking this course:

  1. General Physics
  2. Calculus
  3. Basic Electronics

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